Thermal conductive tape
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Thermal conductive tape
Thermally conductive tape
Double sided thermal conductive tape
Thermal conductive tape
Thermally conductive tapeJintuo™ Conductive tape
Description of thermally conductive tape
Thermally conductive tape is made by the combination of high performance acrylic glue and high thermal conductivity ceramic powder, which can offer reliable and durable thermal conductivity.
The adhesive is also electrically isolating the surfaces and available with one or two side release paper or film.
Thermally conductive tape is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices.
Features of thermally conductive tape
Offering improved surface wet out and excellent shock performance;
Providing on a silicone treated polyester liner for ease of handling and die cutting;
High acrylic adhesive tape for pressure sensitive of various surfaces;
High-performance, thermally conductivity acrylic adhesive;
Stable performance, economic cost;
Excellent adhesion strength;
Excellent long term reliability, electrical insulation and flame retardant performance
Technical data of thermally conductive tape
| Item No | Carrier | Thickness
mm |
Adhesive | Color | Adhesion to steel
(N/25mm) |
Holding power (hour) | Thermal conductivity
(w/m-k) |
Heat resistance.（℃） |
| 8125 | fiberglass fabric | 0.125 | Solvent acrylic | White | 14 | ≥12 | 0.8 | 150 |
| 8250 | fiberglass fabric | 0.25 | Solvent acrylic | White | 14 | ≥12 | 0.8 | 150 |
| 8500 | fiberglass fabric | 0.5 | Solvent acrylic | White | 14 | ≥12 | 0.7 | 150 |
| 8100 | fiberglass fabric | 1.0 | Solvent acrylic | White | 14 | ≥12 | 0.6 | 150 |
The data in the sheet is general product testing value, not stand for each product real value. It is for customers’ reference.
Packing: standard packaging or OEM packing for thermally conductive tape according to customers’ request.
Thermal conductive tape
China thermally conductive tape supplier and manufacturer, Foshan Jintuo Adhesive products Co., Ltd.
Usage guide and storage of thermal conductive tape
Make sure to remove any oils, moisture, dust, etc. from the substrate;
As this is a pressure-sensitive adhesive, make sure to thoroughly use a roller or press for crimping. If crimping is not performed thoroughly enough, its properties and external view may be negatively affected;
Clean adhesion may not occur if a surface is highly irregular or warped. Smooth it out as much as possible;
It takes a little time for the tape’s original adhesive strength to take full effect, so avoid placing or using the tape in a situation in which a lot of strength is needed until several hours have passed from the time of attachment
Storage Precautions
Make sure to store this product in a box.
Avoid storing in high-temperature or high-moisture areas. This product should be stored in a cool, dark area away from direct sunlight (at a temperature of no more than 25℃).
Please use this tape within 6 months of storage.
Take a careful consideration if this product is adapted to the use, purpose and condition before using. The tape may peel in some cases depending on substrate and attachment conditions.
When using this product in areas that may pose a risk of accident, use together with a different joining method.
Physical properties of thermally conductive tape:
| Test Item | Test method | Unit | Test Value |
| Reinforcement carrier | – | – | Fiberglass |
| Color | Visual | – | White |
| Thickness | ASM D374 | mm | 0.1 to 1 |
| Temperature Resistance | – | °C | 180 |
| Adhesion strength | ASTM D412 | Kg/inch2 | 1.2 |
| Breakdown voltage | ASTM D149 | KV/mm | 3 to 7 |
| Initial adhesion | ASTM D1002 | kg/inch | 0.6 to 1.5 |
| Thermal conductivity | ASTM D5470 | W/m-k | 1.5 |
| Continuous use temp | EN 344 | °C | -40 to +180 |
The data in the sheet is general product testing value, not stand for each product real value. It is for customers’ reference.
Applications of thermally conductive tape
Mounting thermometric cooling modules, bonding heat sinks to microprocessors;
Used for the heat dissipation of radiator and PCB board;
Replace the fixed mode of hot melt adhesive, screw and buckle;
Make the heat sink fixed to the encapsulated chip;
bonding TAB-mounted IC and power transistor to PCB, and power transistor to heat sink in notebook computers, high performance CPU, chipsets, mobile, electronic appliances, power conversion and amplification modules;
LED lighting and LED tube, LED light bar, LED backlight etc.
Electronic equipments;
Assemble Article light components and Metal frame;
Make the radiator fixed to the power supply circuit board or the vehicle control circuit board
